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HHuawei Technologies
Kista, Sweden12 days ago
English level
B2, upper-intermediate
An email or a Telegram message to the recruiter
Founded in 1987, Huawei Technologies has grown into a global leader in telecommunications and network solutions, with innovation at the core of everything we do. Huawei established its first overseas R&D office in Sweden in 2000, and since then, we’ve expanded rapidly. Today, over 400 R&D engineers are pushing boundaries in Stockholm, Gothenburg, and Lund, working on groundbreaking 6G wireless systems that shape tomorrow’s technology.
Join us on our journey to develop the future of tech and be a part of a team that thrives on innovation, works hard to solve the industry’s biggest challenges, and collaborates with top engineers worldwide. If you’re ready to contribute to world-changing advancements, we want you on board!
AI accelerators face two major challenges: the memory wall and the thermal wall. While 3D integration offers a promising solution to the memory wall, it can exacerbate thermal challenges. This project aims to develop a simulation framework for evaluating the power and thermal characteristics of 3D-integrated computing systems employing conventional and emerging memory technologies, such as advanced SRAM and MRAM. The work involves integrating architectural simulators, such as gem5, with power estimation models and thermal simulation tools, such as HotSpot. The developed framework will be used to investigate the impact of memory technologies, reinforcement based task scheduling and workload characteristics on power consumption, performance, and temperature distribution of the AI SoC.
Given our current project schedules, we are looking for master’s students available to start in spring 2027.
Founded in 1987, Huawei Technologies has grown into a global leader in telecommunications and network solutions, with innovation at the core of everything we do. Huawei established its first overseas R&D office in Sweden in 2000, and since then, we’ve expanded rapidly. Today, over 400 R&D engineers are pushing boundaries in Stockholm, Gothenburg, and Lund, working on groundbreaking 6G wireless systems that shape tomorrow’s technology.
Join us on our journey to develop the future of tech and be a part of a team that thrives on innovation, works hard to solve the industry’s biggest challenges, and collaborates with top engineers worldwide. If you’re ready to contribute to world-changing advancements, we want you on board!
AI accelerators face two major challenges: the memory wall and the thermal wall. While 3D integration offers a promising solution to the memory wall, it can exacerbate thermal challenges. This project aims to develop a simulation framework for evaluating the power and thermal characteristics of 3D-integrated computing systems employing conventional and emerging memory technologies, such as advanced SRAM and MRAM. The work involves integrating architectural simulators, such as gem5, with power estimation models and thermal simulation tools, such as HotSpot. The developed framework will be used to investigate the impact of memory technologies, reinforcement based task scheduling and workload characteristics on power consumption, performance, and temperature distribution of the AI SoC.
Given our current project schedules, we are looking for master’s students available to start in spring 2027.
Are you ready to apply your skills in a real-world setting and help us lead the charge in tech innovation? Join Huawei Sweden R&D, and let’s make tech history together!
We compare skills, grade, work format and salary
Most often 37,200 to 66,000
